3/17/2024 0 Comments Reflow solder profile tin lead![]() Shin, Creep Rupture of Lead-Free Sn-3.5Ag-Cu Solders, J. Michon, Fracture of Sn-3.5%Ag Solder Alloy under Creep, J. ![]() Wolter, Microstructure and Creep Behaviour of Eutectic SnAg and SnAgCu Solders, Microelectron. Chu, Creep Rupture of Lead-Free Sn-3.5Ag and Sn-3.5Ag-0.5Cu Solders, J. Lepistö, The Effect of Solder Paste Composition on the Reliability of SnAgCu Joints, Microelectron. Wang, Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen, IEEE Trans. Wang, Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, Mater. Neo, Thermal Cycling Aging Effects on Sn-Ag-Cu Solder Joint Microstructure, IMC and Strength, Thin Solid Films, 2004, 462-463(SPEC. Frear, Microstructural Evolution During Thermomechanical Fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb Solder Joints, IEEE Trans. Mhaisalkar, Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages, IEEE Trans. Long, Corrosion Behavior of Sn-Based Lead-Free Solder Alloys: A Review, J. Paik, Wettability and Interfacial Morphology of Sn-3.0Ag-0.5Cu Solder on Electroless Nickel Plated ZnS Transparent Ceramic, J. Shangguan, Lead-Free Solder Interconnect Reliability, ASM International, Cleveland, 2005 Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Lee, Fatigue Life Evaluation of Lead-Free Solder Under Thermal and Mechanical Loads, in Proceedings- Electronic Components and Technology Conference, (Reno, NV) (2007), pp. Longford, Chip Packaging Challenges… A Roadmap Based Overview, Microelectron. Paik, A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling, IEEE Trans. He, Recent Advances in Nano-Materials for Packaging of Electronic Devices, J. It was found that by controlling the microstructure development through the reflow rate, the solder joint’s thermal fatigue life can be extended, and concurrently, the reliability of the electronic package can be enhanced. The microstructure was inspected by cross-sectioning the solder samples using scanning electron microscopy with energy-dispersive x-ray spectroscopy. Finite element analysis was used to predict the primary deformation mechanism. To characterize reliability, the samples endured thermal cycling − 40-125 ☌ until electrical failure. The different microstructures of each sample were created by controlling the cooling rate, fast or slow, during reflow. In this study, two solder alloys, eutectic 63Sn37Pb and lead-free 95.5Sn4.0Ag0.5Cu, were tested for their thermal fatigue reliability and were observed for changes in microstructure. The mechanical reliability of interconnection is dependent on the microstructure evolution that occurs within the solder due to the temperature changes primarily from transportation, storage, and device usage. In electronic package design, solder joints are critical in providing electrical connections and mechanical support.
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